“In the next decade, we will see the continued digitization of everything. Five foundational technology superpowers — compute, connectivity, infrastructure, AI and sensing — will profoundly shape how we experience the world,” said Intel CEO Pat Gelsinger. “Developers, both software and hardware focused, will build this future. They are the true magicians that advance what’s possible. Fostering this open ecosystem is at the center of our transformation and the developer community is essential to our success.”
In his keynote to open the event, Gelsinger, together with Ria Cheruvu, AI Ethics Lead Architect at Intel, presented a number of challenges that developers face — vendor lock-in, access to the latest hardware, productivity and time-to-market, and security, to name a few — and introduced a multitude of solutions to help overcome them, including:
Intel Developer Cloud: Starting in a limited beta trial, the Intel Developer Cloud has expanded to give developers and partners early and efficient access to Intel technologies — from a few months up to a full year ahead of product availability.
During beta, selected customers and developers can try out and test many of Intel’s latest platforms in the coming weeks, including 4th Gen Intel Xeon Scalable processors (Sapphire Rapids), 4th Gen Intel Xeon processors with high bandwidth memory (HBM), Intel Xeon D processors, Habana Gaudi2 deep learning accelerators, Intel Data Center GPU (code-named Ponte Vecchio) and Intel Data Center GPU Flex Series.
Intel Geti
The new and collaborative Intel Geti computer vision platform (formerly Sonoma Creek) enables anyone in the enterprise — from data scientists to domain experts — to quickly and easily develop effective AI models. Through a single interface for data upload, annotation, model training and retraining, Intel Geti reduces the time, AI expertise and cost needed to develop models. With built-in optimizations for OpenVINO, teams can deploy high-quality computer vision AI within their enterprises to drive innovation, automation and productivity.
The Intel Developer Cloud, together with developer tools and resources designed to optimize performance including Intel oneAPI toolkits and the Intel Geti platform, can help accelerate time to market for solutions built on Intel platforms.
Gelsinger also used the occasion to present the latest advances across Intel’s product portfolio, including:
- A new standard for desktop processor performance: 13th Gen Intel Core desktop processors, led by the flagship Intel Core i9-13900K, help users better game, create and work with up to 15% better single-threaded performance and up to 41% better multi-threaded performance gen-over-gen.
- A big step for Intel GPUs: Gelsinger provided updates across Intel’s graphics products, a key area of growth for Intel. Server blades with the Intel Data Center GPU, code-named Ponte Vecchio, are now shipping to Argonne National Laboratory to power the Aurora supercomputer.
- New workloads for Flex Series GPUs: The Intel Data Center GPU Flex Series, announced in August, gives customers a single GPU solution for a wide range of visual cloud workloads. It will now run popular industry AI and deep learning frameworks, including OpenVINO, TensorFlow and PyTorch. AI neuroscience customer Numenta, working in collaboration with Stanford University on real-world inference workloads on MRI data using Intel’s Flex Series GPU, is reporting amazing performance results.
- Intel Arc GPUs for gamers: Intel is committed to bringing back price and performance balance for gamers with the Intel Arc graphics family. The Intel Arc A770 GPU will be available in a variety of designs at retail starting at $329 on Oct. 12, providing compelling content creation and 1440p gaming performance.
- A high-fidelity AI boost for games: XeSS, or Xe Super Sampling, a gaming performance accelerator that works across Intel discrete and integrated graphics, is now rolling out to existing games through updates and will be available in more than 20 titles this year. The XeSS software developer kit is also now available on GitHub.
- Many devices, one experience: Intel Unison is a new software solution that provides seamless connectivity between phones (Android and iOS) and PCs — starting with functionality including file transfer, text messaging, phone calls and phone notifications — coming to new laptops starting later this year.
- Data center acceleration, on demand: 4th Gen Intel Xeon Scalable processors include a number of accelerators for AI, analytics, networking, storage and other demanding workloads. Through the new Intel On Demand activation model, customers can turn on additional accelerators, beyond the base configuration of the original SKU, for greater flexibility and choice when needed.
A “new era for chip manufacturing”
In his speech, JS Choi, CEO of Samsung Display, joined Gelsinger to voice support for the Universal Chiplet Interconnect Express (UCIe) consortium, which aims to create an open ecosystem for enabling chiplets designed and manufactured on different process technologies by different vendors to work together when integrated with advanced packaging technologies. With the three largest chipmakers and more than 80 of the leading companies in the semiconductor industry joining UCIe, “we are now making it a reality,” Gelsinger said.
To lead this platform transformation enabling new customer and partner solutions with chiplets, Gelsinger explained that “Intel and Intel Foundry Services will usher in the era of the systems foundry,” with four major components: wafer manufacturing, packaging, software and an open chiplet ecosystem. “Innovation once thought impossible has opened entirely new possibilities for chipmaking,” Gelsinger said.
Intel previewed another such innovation in development: a breakthrough pluggable co-package photonics solution. Optical connections hold promise to enable new levels of chip-to-chip bandwidth, particularly in the data center, but manufacturing difficulties make them untenably expensive. To overcome this, Intel researchers devised a robust, high-yielding, glass-based solution with a pluggable connector that simplifies manufacturing and lowers costs, opening possibilities for new system and chip package architectures in the future.
